| Professional Technical Engineer with extensive experience in failure analysis of microelectronic devices. Expert knowledge includes Failure Mode Analysis (FMA), Microstructure Analysis (MSA), process engineering, and laboratory administration. Proven abilities in the operation and maintenance of microscopy (SEM, WDS and XRF). Skilled in metallographic analysis, energy dispersive spectroscopy (X-ray analysis), chemical analysis, thin film deposition, samples preparation and micro sectioning of sample devices. Demonstrated strengths include ability to perform detailed analysis and prepare recommendations leading to implementation of manufacturing process improvements. Fluent in Spanish. |